PRIN PACKAGE DEVELOPMENT ENGR _FOL | China

Job Position: PRIN PACKAGE DEVELOPMENT ENGR _FOL
Job Description: ON Semiconductor – Suzhou, Jiangsu – Responsible for Assembly Process Development and Characterization for Code-S and Enabling Technology in Semiconductor FOL (Front of Line) area as Process Development Engineer Major Process Responsibility on Die Attach (Soft Solder and Ag Epoxy) ,Wire Bonding (Heavy Al Wire Bonidng), SMT and support heatsink attach process. Capable to understand and discuss proposed design and new proposal upgraded Capability understanding Design FMEA, upgrading DFMEA and making Process FMEA from DFMEA Capability to define KPIV from FMEA Failures Modes Capability to define KPOV and making result of KOPV and analysis from it Responsible for providing Technical reports with satisfying KPIV versus KPOV from FMEA failures modes based on JMP analysis Working with development engineers to generate and create documents deliverables such as preliminary Control Plan from D/PFMEA according to APQP procedure Responsible for Sharing and Communication with Development Engineers and Manufacturing Engineers …see more details

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